2024第二届热管理材料技术博览会
---导热散热材料、双面胶、胶粘剂展览会
〓 同期展览 〓
2024热管理技术大会
亚洲电子生产设备暨微电子工业展览会
中国电子半导体产业创新发展大会暨国际电子电路（大湾区）展览会
深圳国际电子元器件及物料采购展览会
智能工厂及自动化技术展览会
电子技术快速迭代进步，芯片、器件和电子设备等向微型化、高性能化、集成化及多功能等方向发展，功率密度和发热量急剧攀高。在绿色发展目标下，电力电子、半导体、通信、新能源、汽车、绿色建筑等行业迫切的节能环保需求；5G、消费电子、功率器件、人工智能、XR、Ai、数据中心、物联网、动力电池、储能、工业4.0等领域技术的创新应用，都积极推动了高效的热管理材料技术和创新性解决方案的发展，以保证终端产品的效率、可靠性、安全性、耐用性和持续稳定性。
With the rapid development of electronic technology, chips, devices and electronic equipment are developing towards miniaturization, high performance, integration and multi-functions. Under the goals of green development, the country focuses its strategic plans on energy conservation and environmental protection in Electronics, Semiconductors, Communications, New Energy, Automobiles, Green Buildings and other industries, as well as technological innovation applications in Consumer Electronics, Power Semiconductor Devices， 5G, Artificial Intelligence, XR, Data Centers, Internet of Things, Power Batteries, Energy Storage, Industry 4.0. Those plans and needs actively promote the development of efficient thermal management materials technology and innovative solutions to ensure the efficiency, reliability, safety, durability and continuous stability of end products.
2024年“第二届热管理材料技术博览会”的举办，将高效呈现热管理产业链的一站式价值对接平台，以满足和促进热管理行业各单位交流、合作和共赢发展。创新型的材料、仪器、设备、设计与仿真、解决方案、应用场景、专利技术等荟聚链接和呈现将是博览会的重要组成部分；热管理领域科学、材料、技术和工程等相关专题论坛、圆桌/闭门、热管理Hackathon、创新创业项目展示、新品发布、需求对接等活动也将精彩同期呈现，特别是科研单位创新性的技术和成果也将获得从实验室对接转移到市场的机会。
2024第二届热管理材料技术博览会（iTherMEXPO 2024）
展会时间：2024年11月6-8日
展会地点：深圳国际会展中心（宝安）7号馆
主办单位：中国生产力促进中心协会新材料专业委员会、深圳市德泰中研信息科技有限公司(DT新材料)
承办单位：汉慕会展服务（上海）有限公司
Time: November, 6th-8th, 2024
Venue: Shenzhen World Exhibition&Convention Center (Bao'an) HALL 7
Hosts: China Association of Productivity Promotion Centers New Meterials committee DT New Materials, Shenzhen DT Information & Technology CO., Ltd.,Hanmu Exhibition (Shanghai) Co., Ltd.
①行业产业链资源整合，与超过70%的专业观众建立有效业务联系。
②把握和洞见未来发展趋势，创造极佳的商务及技术分享互动，收获广阔的商业机会。
① Integrate the Industry chain resources, and build effective business connections with more than 70% professional visitors.
② Gain insight into future development trends, have excellent business and technology sharing interaction experience, and gain a wide range of business opportunities.
1. 材料主题展示区
原材料：导热填料、聚合物基底材料、封装材料等
导/散热材料：热界面材料、导热高分子材料、碳材料、陶瓷基板、热沉材料、相变材料（储热）等
隔热材料：气凝胶、泡沫隔热材料、真空板、碳毡、复合保温隔热材料等
辅助材料与配件：离型膜、双面胶、胶粘剂、密封剂等
Raw Materials: thermally conductive fillers, polymer materials, package materials, etc.
Thermal Conduction\Dissipation Materials: thermal interface materi- als, thermal conductive polymer materials, carbon materials, ceramic substrate, heat sink, phase change materials (heat storage), etc.
Thermal insulation materials: aerogel materials, foam insulation materi- al, vacuum plate, carbon felt, composite thermal insulation materials, etc.
Auxiliary materials: release transfer tape, adhesive,sealant,double sided tape, etc.
2. 液冷主题展示区
原材料：冷却液，金属材料等
零部件：快接头，管路，膨胀阀，节流阀，电磁阀，泵，冷板，压缩机，蒸发器，机箱冷量分配单元、不间断电源等
液冷技术：冷板式液冷，浸没式液冷，喷淋式液冷，智能温控技术，模拟仿真与设计，数据中心解决方案等
Raw Materials: coolant, metal materials, etc.
Components: quick coupling, pipeline, expansion valve, throttle valve, solenoid valve, pump, cooling plate, compressor, evaporator, tank, Coolant distribution unit, uninterruptible power supply, etc.
Liquid Cooling Technology: cold plate liquid cooling, immersion liquid cooling, spray liquid cooling, intelligent temperature control technology, simulation and design, data center solutions, etc.
3. 仪器/设备展示区
分析测试仪器：热物性测量设备，气体检测和分析，黏度计，拉力机，密度计，硬度仪，X射线衍射仪，漏液检测等
自动化设备：点胶机，涂布/覆膜/压延/收卷，碳化/石墨化，模切；研磨，分散，均质，脱泡，灌装，封装，焊接，压铸，真空注液等
Analysis and testing instruments: thermophysical properties measure- ment equipments, gas detection and analysis, viscometer, tension machine, densitometer, sclerometer, X-ray diffractometer, leakage detection, etc.
Automatic equipment: dispensing machine, coating/laminating/calen- dering/winding, carbonization/graphitization, die cutting; grinding, dispersion, homogenization, defoaming, filling, encapsulation, welding, die casting, vacuum injection, etc.
